Collimated deposition apparatus

Details Collimated deposition apparatus Collimated deposition apparatus

C - Chemistry, Metallurgy

23

C

C23C 14/35 (2006.01) C23C 14/04 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2111536

COLLIMATED DEPOSITION APPARATUS ABSTRACT OF THE DISCLOSURE Sputtering apparatus using a collimating filter to limit the angles at which sputtered particles will reach the surface of the substrate or workpiece being processed is shown. The sputtering apparatus relies on a combination of a planar sputter source larger in size than the workpiece and having highly uniform emission characteristics across the much of its surface, including its center; a collimating filter; and low operating pressure to avoid scattering of sputtered atoms after they have passed through the collimation filter. In the preferred embodiment, the collimation filter is made from a material which has substantially the same thermal coefficient of expansion as the film which is deposited on the substrate. In one specific embodiment, a titanium collimation filter is used when the sputtering system is used to deposit filmy of titanium, titanium nitride or titanium/tungston alloy.

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