Collimated deposition apparatus and method

Details Collimated deposition apparatus and method Collimated deposition apparatus and method

C - Chemistry, Metallurgy

23

C

204/167, 204/96.

C23C 14/34 (2006.01) C23C 14/04 (2006.01) C23C 14/35 (2006.01) C23C 14/56 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2035106

-21- Abstract of the Disclosure Sputtering apparatus and method which are particularly suitable for forming step coatings. A workpiece is supported in a chamber, particles are emitted from a sputter source in a substantially uniform manner throughout an area of greater lateral extent than the workpiece, the pressure within the chamber is maintained at a level which is sufficiently low to prevent substantial scattering of the particles between the source and the workpiece, and the particles are passed through a collimating filter having a plurality of transmissive cells with a length to diameter ratio on the order of 1:1 to 3:1 positioned between the source and the workpiece to limit the angles at which the particles can impinge upon the workpiece.

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