C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/77
C23C 18/28 (2006.01) C23C 18/40 (2006.01) H05K 3/18 (2006.01)
Patent
CA 1047331
PROCESS FOR ELECTROLESS PLATING USING COLLOID SENSITIZATION Abstract of the Disclosure A process is described for the electroless deposition of metals on nonmetallic surfaces. The process involves pretreatment of the nonmetallic surface so as to obtain a surface finish suitable for deposition of colloidal sensitizers which catalyze electroless metallic deposition. The nonmetallic surface is then exposed to a colloidal catalyst solution (typically SnCl2/PdCl2) followed by an acid rinse. On completion of this surface activation procedure, the surface is exposed to a bath for the electroless deposition of metal. This procedure, which differs from that traditionally used, insures more reliable catalyst for electroless deposition of metals with shorter initiation times and is simpler in procedure and lower in cost. - i -
251548
Cohen Richard L.
Meek Ronald L.
Na
Western Electric Company Incorporated
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