Combination of aqueous baths for the non-electrical...

Details Combination of aqueous baths for the non-electrical... Combination of aqueous baths for the non-electrical...

C - Chemistry, Metallurgy

23

C

C23C 18/44 (2006.01)

Patent

CA 2086341

The invention relates to a combination of aqueous baths for electroless gold deposition and, preferably, for the deposition of gold onto nickel and nickel alloy films. The combination consists of a preliminary bath and a primary bath and, optionally, a pickling solution and a pretreatment. The gold film which is obtained is chip-bondable and wire-bondable.

La présente invention a trait à une combinaison de bains aqueux pour le dépôt autocatalytique de l'or et, de préférence, pour le dépôt de l'or sur les films de nickel et d'alliage de nickel. La combinaison se compose d'un bain préliminaire et d'un bain primaire et, optionnellement, d'un bain de décapage et d'un traitement préalable. Le film d'or ainsi obtenu peut servir à la soudure des puces ou des fils.

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