Combination product for bonding parts to be joined...

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 11/06 (2006.01) C09J 4/00 (2006.01) C09J 4/04 (2006.01) C09J 5/02 (2006.01)

Patent

CA 2084295

The use of certain imidazole derivatives such as 1-benzyl-2-methylimidazole, 1- benzylimidazole. 1-hydroxyethyl-2-phenyl- 4,5-dihydroimidazole, 2-phenyl-4,5-dihydroimidazole and N,N'carbonyldiimidazoie as a primer with cyanacrylate adhesives to bond mouldings, particularly polyolefins, results in high-strength adhesive bonds even if time is long between the primer and the adhesive coating.

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