Combined continuous plating apparatus for hot-dip plating...

C - Chemistry – Metallurgy – 23 – C

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C23C 2/00 (2006.01) C23C 2/40 (2006.01) C23C 14/56 (2006.01)

Patent

CA 1242316

Abstract of the Disclosure Disclosed is a combined continuous plating apparatus for hot-dip plating and vacuum deposition plating characterized in that the outlet of the gas reduction annealing furnace of a conventional continuous hot-dip plating apparatus and the inlet of the seal roll chamber of a known continuous vacuum deposition plating apparatus are connected through a pressurized chamber in order to prevent invasion of hydrogen-containing reduction gas into the vacuum deposition chamber, whereby is prevented the possibility of the hydrogen-containing gas causing an explosion should air leak into the vacuum deposition chamber.

491387

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