C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
32/37
C23C 2/00 (2006.01) C23C 2/40 (2006.01) C23C 14/56 (2006.01)
Patent
CA 1242316
Abstract of the Disclosure Disclosed is a combined continuous plating apparatus for hot-dip plating and vacuum deposition plating characterized in that the outlet of the gas reduction annealing furnace of a conventional continuous hot-dip plating apparatus and the inlet of the seal roll chamber of a known continuous vacuum deposition plating apparatus are connected through a pressurized chamber in order to prevent invasion of hydrogen-containing reduction gas into the vacuum deposition chamber, whereby is prevented the possibility of the hydrogen-containing gas causing an explosion should air leak into the vacuum deposition chamber.
491387
Aiko Takuya
Furukawa Heizaburo
Kato Mitsuo
Kittaka Toshiharu
Shimozato Yoshio
Mitsubishi Jukogyo Kabushiki Kaisha
Nisshin Steel Company Ltd.
Riches Mckenzie & Herbert Llp
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