Compact chip labelling using stepper technology

Details Compact chip labelling using stepper technology Compact chip labelling using stepper technology

G - Physics

03

F

G03F 9/00 (2006.01) H01L 23/544 (2006.01)

Patent

CA 2320612

A method is provided for printing identification patterns on photoresist- coated wafers comprising integrated electronic circuits or other devices. The photoresist is subjected to at least 2 partial exposures of electromagnetic radiation via a first and a second reticle. The first reticle comprises an area transparent to electromagnetic radiation having a surface equal to or greater than the surface of the identification pattern to be printed on the photoresist. The second reticle comprises a plurality of identification patterns. The photoresist is exposes sequentially to the projection of each reticle such that the desired identification pattern and the area of the first reticle are projected on the same area of the photoresist with the proviso that the sum of the partial doses is equal to or greater than the dose required for full sensitization. This method allows the printing of small identification characters on wafers using the stepper technology.

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