C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 177/00 (2006.01) C09J 157/00 (2006.01) C09J 163/00 (2006.01)
Patent
CA 2078880
2078880 9200364 PCTABS00010 Disclosed are epoxy/polyamide adhesive compositions having improved flexibility containing a polyolefin and a maleated polypropylene. A typical epoxy/polyamide adhesive is bisphenol A/epichlorohydrin.
Miller Richard Anthony
Olsen David Justin
Eastman Chemical Company
Gowling Lafleur Henderson Llp
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