Compatible self-crosslinking poly (amide-imide) polyepoxide...

Details Compatible self-crosslinking poly (amide-imide) polyepoxide... Compatible self-crosslinking poly (amide-imide) polyepoxide...

C - Chemistry, Metallurgy

08

L

154/103, 117/196

C08L 79/08 (2006.01) C08J 5/02 (2006.01) C08L 63/02 (2006.01)

Patent

CA 1274640

ABSTRACT OF THE DISCLOSURE Disclosed is a composition comprising about 5 to about 95 phr of a polyepoxide or other resinous component, about 20 to about 90% of an aprotic solvent, about 5 to about 95 phr of a polyimide having sufficient amic acid functionality to be soluble in the solvent, and sufficient water to hydrolyze the polyimide. A laminate is made from the composition by heating it until the amic acid function- ality is substantially eliminated, then impregnating a fibrous substrate with the composition, heating the impreg- nated substrate to evaporate the solvent and B-stage the composition and form a prepreg, forming a stack of the prepregs, and heating and pressing the stack of prepregs to cure the composition. A wire enamel can also be made from the composition.

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