Completely molded die set for crimping objects placed therein

B - Operations – Transporting – 21 – J

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B21J 9/08 (2006.01) B21F 15/06 (2006.01) H01R 43/058 (2006.01) H01R 4/18 (2006.01) H01R 9/05 (2006.01) H01R 43/042 (2006.01)

Patent

CA 1093796

DIE SET ABSTRACT OF THE DISCLOSURE: The invention is directed to a die set wherein both the upper and lower die members are molded of a semi- rigid, flexible material. The physical properties of the materials from which the die members are formed are such that they resemble those of typical conductor and connector insulations. The dies can deform around the insulation of the conductor and shield without nicking, cutting or otherwise damaging the metallic conductor or other portions of the insulated conductor. The dies can conform to concentric and nonconcentric conductor configurations and are thus not sensitive to the conductor concentricity and to the conductor size in the range of conductor sizes the dies are formed to handle. The use of alignment ribs, along with the die interlocks serve to center the two die members and stops serve to prevent rotation of a connector in the die set and control the maximum die set opening.

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