Compliant and crosslinkable thermal interface materials

Details Compliant and crosslinkable thermal interface materials Compliant and crosslinkable thermal interface materials

H - Electricity

01

B

H01B 1/04 (2006.01) B23K 35/02 (2006.01) H01B 1/02 (2006.01) H01L 23/373 (2006.01) B23K 35/26 (2006.01) B23K 35/36 (2006.01)

Patent

CA 2433567

Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.

L'invention concerne un matériau d'interface thermique souple et réticulable comprenant au moins un mélange de résine de silicone, au moins un agent mouillant et au moins un matériau de charge thermiquement conducteur, et procédé de préparation et d'utilisation de ce matériau, ainsi qu'un procédé permettant d'améliorer la conductivité thermique de systèmes à base de polymères et de résines.

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