Compliant leads for area array surface mounted components

Details Compliant leads for area array surface mounted components Compliant leads for area array surface mounted components

H - Electricity

01

L

H01L 23/50 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2288605

An area array integrated circuit package having contact pads is provided with compliant rectangular shaped connection leads each attached to a contact pad. The leads are arranged and oriented on the surface of the package around the neutral point of the package such that the flat width dimension of each lead faces the neutral point of the contact array, thereby offering optimal compliance against thermally induced deformation and resulting in improved interconnection reliability.

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