Compliant pre-form interconnect

Details Compliant pre-form interconnect Compliant pre-form interconnect

B - Operations, Transporting

32

B

B32B 27/04 (2006.01) H01L 23/053 (2006.01)

Patent

CA 2442394

An assembly (10) having a thermosetting layer (100) pierced by a plurality of conductors (300) is formed on a release sheet (200) and subsequently sandwiched between an IC and a PWB or other supporting surface and subsequently cured. The release sheet is removed either before or during curing of the thermosetting material. Removal prior to curing may be accomplished via peeling. Removal during curing may be by destruction of the layer by the curing process.

Un ensemble (10) dont une couche thermodurcissable (100) est percée d'une pluralité de conducteurs (300) est formé sur une feuille de décollage (200) puis prise en sandwich entre un circuit intégré et une carte à circuit imprimé ou toute autre surface support, à la suite de quoi, on la met à durcir. L'élimination de la feuille de décollage peut se faire avant ou pendant le durcissage du matériau thermodurcissable. Avant, il suffit de la dépelliculer, alors que pendant la couche se détruit sous l'action du traitement de durcissement.

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