Component evaluation system

H - Electricity – 05 – K

Patent

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354/21

H05K 13/08 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2036687

-59- ABSTRACT OF THE DISCLOSURE A system is disclosed which operates to collect high resolution three-dimensional surface mesh data from mechanical components which are used for component evaluation. The system includes a multidimensionally movable fixture mount for holding the mechanical components. A structured light pattern emitting projector is provided together with an image sensing camera for detecting impingement of the light pattern on the mechanical component and for generating the surface data. A set of software tools analyzes the data to provide numerical or quantitative component analysis and further presents the data in display form to allow intuitive or qualitative analysis for product and process improvement.

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