Component having an overlapping laser track; method for...

B - Operations – Transporting – 23 – K

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B23K 26/06 (2006.01) B23K 26/36 (2006.01) B23K 26/40 (2006.01) B28D 5/00 (2006.01) C03B 33/02 (2006.01) C03B 33/09 (2006.01) H01L 21/78 (2006.01)

Patent

CA 2757229

The invention relates to a component (1) comprising a laser track (2) as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component (1) into individual components. In order to ensure that, upon separation, the fracture always extends along the laser track (2), fractures deviating from the laser track (2) are avoided, and the fracture edges after fracture are formed evenly and do not have jagged edges, it is proposed that the distance between two adjacent laser holes be less than or equal to the diameter of said laser holes, in each case measured on the surface of the component (1).

La présente invention concerne un composant (1) présentant un sillon laser (2) constituant une ligne de rupture affaiblie, qui résulte d'impacts d'un rayon laser, et qui prépare le fractionnement ultérieur du composant (1) en composants individuels. Pour garantir que, lors du fractionnement, la rupture intervienne systématiquement le long du sillon laser (2), que l'on évite les ruptures s'écartant du sillon laser (2), et qu'après rupture, les bords de rupture présentent une forme régulière et nette, l'invention propose que la distance entre deux impacts laser voisins n'excède pas le diamètre de l'impact laser mesuré à la surface du composant (1).

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