Component of printed circuit boards

Details Component of printed circuit boards Component of printed circuit boards

B - Operations, Transporting

32

B

B32B 15/01 (2006.01) B22F 7/04 (2006.01) B32B 3/08 (2006.01) B32B 15/20 (2006.01) H05K 1/03 (2006.01) H05K 3/02 (2006.01)

Patent

CA 2315177

A component (10) for use in manufacturing articles, such as printed circuit boards, comprising a laminate constructed of a sheet of copper foil (20) that, in a finished circuit board, constitutes a functional element, and a sheet of carbon steel (14) having a layer of an inert metal (16) thereon, the sheet of carbon steel (14) constituting a discardable element. One surface (22) of the copper sheet (20) and the surface (18) of the inert metal layer (16) on the carbon steel sheet (14) are essentially uncontaminated and engageable with each other at interfaces. The copper sheet (20) is attached to the inner metal layer (16) of the carbon steel (14) at their borders and defines substantially uncontaminated central zones inwardly of the edges of the sheets that are unjoined at the interfaces.

L'invention concerne un composant (10) utilisé dans la fabrication d'articles, tels que des cartes de circuits imprimés, comprenant une feuille formée à partir d'une feuille de cuivre (20) qui, dans une carte de circuits imprimés terminée, constitue un élément fonctionnel et une feuille d'acier au carbone (14) recouverte d'une couche d'un métal inerte (16), la feuille d'acier au carbone (14) formant un élément détachable. Une surface (22) de la feuille de cuivre (20) et la surface (18) de la couche de métal inerte (16) recouvrant la feuille d'acier au carbone (14) sont essentiellement non contaminées et peuvent entrer en contact l'une avec l'autre au niveau d'interfaces. La feuille de cuivre (20) est fixée à la couche de métal inerte (16) de l'acier au carbone (14) au niveau de leurs limites et définit essentiellement des zones centrales non contaminées à l'intérieur des bords des feuilles qui ne sont pas unies au niveau des interfaces.

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