H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/00 (2006.01) H05K 1/02 (2006.01) H05K 3/30 (2006.01) H05K 3/36 (2006.01) H05K 7/14 (2006.01) H05K 1/14 (2006.01) H05K 1/16 (2006.01) H05K 3/20 (2006.01)
Patent
CA 2394403
The invention provides a system and method for assembling an electrical module. The module comprises a circuit board, a substrate and an electrical component carried on the substrate, The substrate is formed by a stamping process and is mounted at a location on the circuit board. The substrate forms part of an electrical circuit with a circuit in the circuit board and dissipates heat from the circuit board. The substrate and the circuit board are both initially carried in respective frames. Alignment registered in the frames allows the frames to be aligned such that the substrate is positioned at the location on the circuit board.
Cette invention fournit un dispositif et une méthode pour assembler un module électrique. Ce module comprend une carte de circuits imprimés, un substrat et un composant électrique porté par le substrat. Le substrat est formé par estampage et il est monté à un emplacement de la carte de circuits. Ce substrat fait partie d'un circuit électrique situé sur la carte de circuits et il dissipe la chaleur de la carte. Le substrat et la carte de circuits sont tous deux portés initialement dans des cadres respectifs. L'alignement enregistré dans les cadres permet de les aligner, de sorte que le substrat soit placé à l'emplacement de la carte de circuits.
Gauthier David Lorrain
Ho Kai Kwong
Kerklaan Albert John
Wanes John Ohannes
Celestica International Inc.
Murata Power Solutions Inc.
Perry + Currier
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