Composite carrier assembly having an encapsulated sensor and...

G - Physics – 01 – L

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G01L 1/24 (2006.01) G02B 6/36 (2006.01)

Patent

CA 2273314

A structure is provided that includes a structural element and a composite carrier assembly associated with the structural element, such as by being embedded therein, wherein the compatible carrier assembly includes a composite carrier and a sensor disposed with the composite carrier. By embedding the composite carrier assembly within a structural element, the sensor, such as a fiber optic sensor, will measure the conditions, such as the strain, temperature or the like, to which at least a portion of the structural element is subjected in a manner which averages the measurements over a distance greater than the predetermined dimensions of the sensor element. In addition, the thermal, mechanical and electrical characteristics of the composite carrier can be precisely tailored, such as to match those characteristics of the structural element in which the composite carrier is to be embedded, so that the composite carrier will be compatible with the host material of the structural element. The composite carrier also provides increased resistance to corrosion and a corresponding longer life for the encapsulated sensor than conventional techniques. A method is also provided for reliably fabricating a composite carrier assembly, including a curved or otherwise non-linear composite carrier assembly.

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