Composite circuit board with thick embedded conductor and...

H - Electricity – 05 – K

Patent

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356/8

H05K 1/02 (2006.01) H01L 21/48 (2006.01) H01L 23/538 (2006.01) H05K 3/00 (2006.01) H05K 3/20 (2006.01) H05K 1/00 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2030826

ABSTRACT OF THE DISCLOSURE The composite circuit board comprises a substrate made of an insulating material, a thick circuit conductor, embedded in this substrate, which includes a parts-mounting section and has a predetermined circuit pattern, a thin circuit conductor, provided on the surface of said substrate, which includes a land corresponding to the parts- mounting section of said thick circuit conductor and has a predetermined circuit pattern, and a conductor means for electrically connecting said land and said parts-mounting section. In this circuit board, the land and the part- mounting section are connected by a conducting member provided in a through hole formed adjacent to the parts- mounting section.

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