B - Operations – Transporting – 23 – P
Patent
B - Operations, Transporting
23
P
25/140, 57/15
B23P 5/00 (2006.01) B23B 27/20 (2006.01) B23K 31/02 (2006.01) B23K 35/30 (2006.01) B23P 15/32 (2006.01) E21B 10/54 (2006.01) E21B 10/56 (2006.01)
Patent
CA 1216158
TITLE OF THE INVENTION A composite compact component and a process for the production of the same ABSTRACT OF THE DISCLOSURE This invention relates to a composite compact component with a high bond strength between the composite compact and substrate, comprising a composite compact consisting of a diamond or BN compact containing at least 50 % by volume of diamond or BN powder and a base of hard sintered alloy bonded during sintering under an ultra-high pressure and high tem- perature directly or through an interlayer with a thickness of at most 0.5 mm to the diamond or BN compact, and a sub- strate bonded to the base of the composite compact, the sub- strate having a larger volume than the base, in which the substrate is a hard sintered alloy or steel, and the base and substrate are bonded through a high strength metal or alloy, as a filler metal, having a thickness of at most 2 mm and a melting point of at least the liquidus point of the hard sintered alloy.
415073
Hara Akio
Miyake Masaya
Yazu Shuji
Riches Mckenzie & Herbert Llp
Sumitomo Electric Industries Ltd.
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