B - Operations – Transporting – 24 – D
Patent
B - Operations, Transporting
24
D
57/17, 255/69
B24D 3/04 (2006.01) B23B 27/20 (2006.01) B23K 1/002 (2006.01) B23K 31/02 (2006.01) C04B 37/00 (2006.01) E21B 10/56 (2006.01)
Patent
CA 1119006
60-SD-96 ABSTRACT OF THE DISCLOSURE A component comprised of a composite compact, preferably diamond, and a substrate bonded to the compact. A preferred embodiment of the com- ponent is a cutter for a drill bit. The compact is comprised of a layer of bonded diamond or boron nitride particles and a base layer of cemented car- bide bonded, preferably under high temperatures and pressures, to the par- ticulate layer. The particulate layer is degradable by exposure to tempera- tures above a predetermined temperature. The substrate is bonded to the base layer of the compact with a filler metal which,to form a bond,requires the exposure of the surfaces to be bonded to a temperature substantially greater than the degradation temperature of the particulate layer. The com- ponent is fabricated by heating the base layer, filler metal and substrate to a temperature in excess of the degradation temperature while maintaining the temperature of the particulate layer below the degradation temperature via a heat sink.
315515
Company General Electric
Eckersley Raymond A.
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