Composite copper foil and manufacturing method thereof

Details Composite copper foil and manufacturing method thereof Composite copper foil and manufacturing method thereof

C - Chemistry, Metallurgy

25

D

C25D 1/04 (2006.01) C25D 3/38 (2006.01) C25D 5/12 (2006.01) H05K 3/02 (2006.01)

Patent

CA 2397984

A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 µm. There is also presented a method for manufacturing such a composite copper foil.

L'invention porte sur une feuille composite de cuivre (10) comportant un substrat (12) formé par électrodéposition sur une cathode, ladite feuille (12) présentant un côté cathode en contact avec la cathode et un côté électrolyte opposé revêtu d'une couche anti-adhésive (14) très fine sur laquelle est formée par électrodéposition une couche fonctionnelle mince de cuivre présentant une face frontale en contact avec la couche anti-adhésive (14), et une face dorsale. Le côté électrolyte du substrat (12) présente une rugosité superficielle Rz inférieure ou égale à 3,5 µm. L'invention porte sur un procédé de fabrication de ladite feuille composite de cuivre.

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