Composite diamond compact for a wire drawing die and a...

Details Composite diamond compact for a wire drawing die and a... Composite diamond compact for a wire drawing die and a...

B - Operations, Transporting

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B21C 3/02 (2006.01) B01J 3/06 (2006.01) B22F 7/06 (2006.01) B22F 7/08 (2006.01) B23P 5/00 (2006.01) C04B 37/00 (2006.01) C22C 26/00 (2006.01)

Patent

CA 1131919

ABSTRACT OF THE DISCLOSURE The present invention relates to a composite diamond compact for a wire drawing die, in which a part or all of the circumference of a diamond sintered body is surrounded by a cermet consisting of a hard compound of (Mo, W)C type carbide crystals containing molybdenum as a predominant component, bonded by an iron group metal, and the binder phase of the diamond sintered body contains an iron group metal and fine carbide crystals containing molybdenum as a predominant component.

330718

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