Composite film comprising low-dielectric resin and...

Details Composite film comprising low-dielectric resin and... Composite film comprising low-dielectric resin and...

C - Chemistry, Metallurgy

08

L

C08L 77/10 (2006.01) C08J 5/04 (2006.01) C08J 5/18 (2006.01) C08J 5/24 (2006.01) H05K 1/03 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2234317

Provided is a composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300°C of within ~50 X 10 -6/°C . The composite film has characteristics such as a low dielectric constant, favorable mechanical strength, homogeneous structure, light weight, and a low linear thermal expansion coefficient, and the film is useful as a base substrate for a flexible printed circuit board.

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