Composite material having good thermal conductivity

Details Composite material having good thermal conductivity Composite material having good thermal conductivity

C - Chemistry, Metallurgy

08

L

400/1700, 400/51

C08L 87/00 (2006.01) C08K 3/22 (2006.01) C08K 3/28 (2006.01) C08K 3/34 (2006.01) C08K 3/38 (2006.01) C08L 91/06 (2006.01) H01B 3/30 (2006.01)

Patent

CA 2026452

ABSTRACT OF THE DISCLOSURE A highly heat-resistant composite material is used for electrically insulating and highly thermally-conductive parts in electrical and electronic components and comprises a highly heat-resistant polymer and an electrically-insulating, mineral filler having a high thermal conductivity. The composite material is filled, for example, with 50-90 weight percent sintered ceramic is injectable and extrudable and is well-suited for electrical components at 220 volts and operating temperatures up to 15°C. due to its high thermal conductivity above 1 W/mK, its dielectric strength of > 3 kV/mm and its high thermoforming stability of > 180°C.

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