Composite material having improved bond strength and process...

Details Composite material having improved bond strength and process... Composite material having improved bond strength and process...

B - Operations, Transporting

23

K

13/16, 148/47

B23K 3/00 (2006.01) B23K 20/233 (2006.01) B32B 15/01 (2006.01) H05K 1/05 (2006.01)

Patent

CA 1200953

ABSTRACT A composite material having improved bond strength and a substantially smooth external surface comprises a deoxidized copper alloy core material and a copper- aluminum-silicon clad material. The composite is formed by rolling together the core and clad, preferably in an unheated condition, in a single pass with a reduction of about 50% to 75% to form a metallurgical bond between the core and clad and thereafter enhancing the bond strength by heating the bonded core and cladding to a temperature in the range of about 200°C to about 750°C for a time period of about 5 minutes to about 24 hours.

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