Composite material of a polyparabanic acid film and base...

Details Composite material of a polyparabanic acid film and base... Composite material of a polyparabanic acid film and base...

B - Operations, Transporting

32

B

154/41

B32B 17/04 (2006.01) B32B 15/08 (2006.01) B32B 27/00 (2006.01) C08J 5/12 (2006.01) H01B 3/30 (2006.01) H05K 1/03 (2006.01) H05K 1/05 (2006.01) H05K 1/00 (2006.01)

Patent

CA 1063006

ABSTRACT OF THE DISCLOSURE Polyparabanic acid and metal composite laminates are obtained by adhering polyparabanic acid film and copper foil without intermediate adhesive layer except with small amount of solvent which will dissolve polyparabanic acid such as DMF, NMP, DMSO, etc. The laminates are useful for preparing flexible printed circuits which will withstand high soldering temperatures without distortion or delamination.

223620

Affiliated with

Also associated with

Rating

Composite material of a polyparabanic acid film and base... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite material of a polyparabanic acid film and base..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite material of a polyparabanic acid film and base... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-835429