H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/18 (2006.01) H01L 23/552 (2006.01) H01P 1/00 (2006.01) H01P 5/107 (2006.01)
Patent
CA 2109441
A composite microwave circuit module assembly has a dielec- tric substrate which is formed by a lower layer, an in- termediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface and an upper ground surface, respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface and the lower ground surface so as to shield the radio frequency signal circuit. An element mounting cavity is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member. A connection terminal con- nected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure having a contact member resiliently urged to said connection terminal.
Izumi Hiroaki
Kosugi Yuhei
Kusamitsu Hideki
Minowa Yoshio
Omagari Shin-Ichi
Corporation Nec
Smart & Biggar
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