Composite plating apparatus

Details Composite plating apparatus Composite plating apparatus

C - Chemistry, Metallurgy

25

D

C25D 15/00 (2006.01) C25D 5/08 (2006.01) C25D 7/04 (2006.01)

Patent

CA 2218784

A composite plating apparatus includes a cylindrical electrode which is positioned in a hollow section of a workpiece with a surrounding gap left therebetween. A plurality of through-holes are formed across the thickness of an outer wall of the cylindrical electrode. Composite plating liquid is jetted out through the through-holes and impinge on the inner surface of the hollow section to thereby produce turbulence. The turbulent liquid provides a uniform distribution of ceramic particles in the liquid. As a result, the ceramic particles can be co-deposited uniformly in a metallic matrix, and hence a uniform abrasion-resistant characteristic is obtained all over a resultant composite plating film.

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