Composite semiconductor thermoelectric refrigerating device

Details Composite semiconductor thermoelectric refrigerating device Composite semiconductor thermoelectric refrigerating device

H - Electricity

01

L

356/95

H01L 35/00 (2006.01) H01L 35/26 (2006.01) H01L 35/32 (2006.01)

Patent

CA 2028598

ABSTRACT A composite semiconductor thermoelectric refrigerating device comprises dozens or hundreds composite P-N couples electrically connected in series to form an array of required configuration which is fixed with electrical and thermal insulator and combined with heat absorber and thermal radiator respectively by thermoconductive greased films of electrical insulation. Said refrigerating device is characterized by a good thermoconductive metal slate sandwiched between the semiconductor head parts of a thermoelectric element by surface-to-surface brazing. This device can substitute for vapour compression refrigerating devices of medium and small sizes. Model 1 of said thermoelectric refrigerating device is of circular configuration, while model 2 is rectangular. Other models of specific configurations in accordance with requirements can be constructed.

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