Composite substrate and el device using the same

Details Composite substrate and el device using the same Composite substrate and el device using the same

H - Electricity

05

B

H05B 33/02 (2006.01) H05B 33/10 (2006.01) H05B 33/12 (2006.01) H05B 33/22 (2006.01)

Patent

CA 2366571

The invention aims to provide a composite substrate which suppresses reaction of a substrate with a dielectric layer that can otherwise cause degradation of the dielectric layer and which can be sintered at high temperature while minimizing the occurrence of cracks in the dielectric layer, and an EL device using the composite substrate. The object is attained by a composite substrate in which an electrode and a dielectric layer are successively formed on an electrically insulating substrate, the substrate having a coefficient of thermal expansion of 10-20 ppm/K, and an EL device using the composite substrate.

On décrit un substrat composite et un dispositif EL dans lequel la réaction de la couche diélectrique avec le substrat est éliminée, le substrat ne détériorant plus les caractéristiques et pouvant être fritté à une température élevée, la couche diélectrique se fissurant difficilement. Le substrat composite comprend un substrat isolant du point de vue électrique et une électrode ainsi qu'une couche diélectrique. L'électrode et la couche diélectrique sont formées dans cet ordre sur le substrat. Le coefficient de dilatation thermique du substrat est compris entre 10 et 20 ppm/K.

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