Composite substrate for electronic components

H - Electricity – 01 – L

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H01L 23/46 (2006.01) H01L 23/36 (2006.01) H01L 23/373 (2006.01) H01L 23/467 (2006.01) H01L 23/473 (2006.01) H05K 1/02 (2006.01) H05K 1/05 (2006.01)

Patent

CA 1218739

PRECIS DE LA DIVULGATION: Support pour composants électroniques placés chacun dans un boîtier, comprenant une plaque de support sur laquelle sont fixés les boîtiers des composants. La plaque de support est constituée de deux feuilles lisses encadrant une feuille ondulée.. Les feuilles lisses ainsi que la feuille ondulée sont constituées chacune d'un matériau métallique colaminé comprenant deux couches d'un métal bon conducteur encadrant une couche d'un métal très peu dilatable.

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