Composite substrate preparing method, composite substrate,...

Details Composite substrate preparing method, composite substrate,... Composite substrate preparing method, composite substrate,...

H - Electricity

01

L

H01L 49/02 (2006.01) H05B 33/02 (2006.01) H05B 33/10 (2006.01)

Patent

CA 2355417

The invention aims to provide a method for preparing a composite substrate which has minimized surface asperities on a dielectric layer, which are otherwise developed under the influence of an electrode layer, unevenness upon printing, and surface roughness inherent to thick-film dielectrics, which eliminates a need for a polishing step, which is easy to manufacture, and which is applicable to the fabrication of a thin-film light-emitting device of high display quality, as well as the resulting composite substrate and a thin-film EL device using the same. The object is attained by a method for preparing a composite substrate, comprising the steps of forming at least an electrode and a green dielectric layer according to a thick-film technique on an electrically insulating substrate, thereby providing a composite substrate precursor, smoothing the surface of the precursor by WIP process, and firing to complete the composite substrate, as well as the resulting composite substrate and a thin-film EL device using the game.

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