C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
149/14
C23F 1/18 (2006.01) C11D 1/12 (2006.01) C11D 1/835 (2006.01) C23G 1/10 (2006.01) H05K 3/26 (2006.01) H05K 3/38 (2006.01) H05K 3/06 (2006.01)
Patent
CA 2029087
COMPOSITION AND METHOD FOR IMPROVING ADHESION OF COATINGS TO COPPER SURFACES ABSTRACT A composition for cleaning and improving the adhesion characteristics of a copper surface (which is in turn adhered to an underlying substrate) so as to enable a coating, e.g., of photoresist, to be adhered easily and completely to the copper surface, the cleaning and adhesion promoting composition consisting essentially of an aqueous solution of an alkane sulfonic acid, a surfactant and an oxidizing agent of a type, and present in an amount, sufficient to provide controlled conversion of the copper surface to a substantially clean, micro- roughened surface, without removing the copper surface from the underlying substrate, so that the adhesion characteristics of the copper surface are substantially increased for receiving and securely adhering a subsequently applied coating.
Carmody Thomas J.
Kukanskis Peter E.
Williams Barry H.
Carmody Thomas J.
Kukanskis Peter E.
Macdermid Incorporated
Perley-Robertson Hill & Mcdougall Llp
Williams Barry H.
LandOfFree
Composition and method for improving adhesion of coatings to... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Composition and method for improving adhesion of coatings to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition and method for improving adhesion of coatings to... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1487946