Composition and method for reducing copper oxide to metallic...

Details Composition and method for reducing copper oxide to metallic... Composition and method for reducing copper oxide to metallic...

C - Chemistry, Metallurgy

23

F

C23F 3/00 (2006.01) B05D 3/00 (2006.01) B05D 5/00 (2006.01) C01B 6/06 (2006.01) C23C 22/63 (2006.01) C23C 22/83 (2006.01) C23G 1/20 (2006.01) H05K 3/38 (2006.01) C07D 213/18 (2006.01) C07D 295/02 (2006.01) C07D 327/06 (2006.01) C07F 5/02 (2006.01) C22B 5/00 (2006.01) C22B 15/00 (2006.01)

Patent

CA 2254362

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring- forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-lutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

L'invention concerne une composition qui permet de réduire une couche d'oxyde de cuivre en cuivre métallique, de façon à faciliter l'adhésion d'une résine sur ledit cuivre métallique. La composition est une solution réductrice aqueuse qui contient un composé cyclique du borane, par exemple des composés dans lesquels l'élément formateur de cycle est l'azote ou le soufre, tels que le morpholine borane, le pipéridine borane, le pyridine borane, le pipérazine borane, le 2,6-lutidine borane, le 4-méthylomorpholine borane, le 1,4-oxathiane borane et le N,N-diéthylaniline borane.

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