C - Chemistry – Metallurgy – 23 – G
Patent
C - Chemistry, Metallurgy
23
G
C23G 1/20 (2006.01) B05D 3/10 (2006.01) C01B 6/06 (2006.01) C01B 6/10 (2006.01) C09J 5/04 (2006.01) C23C 22/05 (2006.01) C23C 22/63 (2006.01) C23C 22/83 (2006.01) H05K 3/26 (2006.01) H05K 3/38 (2006.01) C09J 5/02 (2006.01)
Patent
CA 2254106
A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing morpholine borane.
La présente invention concerne une composition permettant de réduire en cuivre métal une couche d'oxyde de cuivre afin de favoriser la liaison d'une résine au cuivre métal. La composition considérée est une solution réductrice aqueuse contenant du morpholineborane.
Campbell Scott
Fakler John
Rush Michael
Gowling Lafleur Henderson Llp
Morton International Inc.
Rohm And Haas Chemicals Llc
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