C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
C23F 1/18 (2006.01) C23F 1/44 (2006.01) H05K 3/22 (2006.01) H05K 3/06 (2006.01)
Patent
CA 2248497
A composition and method for stripping tin and solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board is presented. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve the tin-copper alloy, and a source of halide ions in an amount sufficient to significantly improve the resistance between printed circuits.
L'invention décrit une composition et une méthode de pelage de l''étain, de la brasure et de l'alliage de cuivre et d'étain sous-jacent d'un substrat de cuivre se trouvant sur une plaquette de circuits imprimés. Le liquide comprend une solution d'acide nitrique en quantité suffisante pour dissoudre la brasure et l'étain, une source d'ions ferriques en quantité suffisante pour dissoudre l'alliage d'étain et de cuivre, et une source d'ions haloïdes en quantité suffisante pour améliorer la résistance entre les circuits imprimés.
Fakler John T.
Johnson Todd II
Gowling Lafleur Henderson Llp
Morton International Inc.
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