C - Chemistry – Metallurgy – 09 – K
Patent
C - Chemistry, Metallurgy
09
K
149/21
C09K 13/04 (2006.01) C23F 1/00 (2006.01) C23F 1/44 (2006.01)
Patent
CA 1137396
Abstract of the Disclosure An improved process and composition for chemically stripping metallic deposits from a substrate, and particularly, from the contact tips of electroplating racks and like apparatus to maintain proper operating efficiency thereof. The improved composition and method employs an aqueous acidic solution con- taining nitric acid, chloride ions and manganous ions present in an amount sufficient to accelerate the initiation of and the rate of stripping of the metallic deposits. The method and com- position are applicable for chemically stripping a variety of metallic deposits at stripping rates substantially higher than those heretofore attainable with prior art compositions and techniques. -16-
356214
Oxy Metal Industries Corporation
Swabey Ogilvy Renault
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