C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
18/1185, 149/24,
C23C 18/26 (2006.01) C08J 7/02 (2006.01) C08J 7/12 (2006.01) C23C 18/22 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)
Patent
CA 1306409
ABSTRACT A process for specially conditioning and etching a polycarbonate resin prior to metal plating to enhance the coverage and adhesiveness of metal plating to the resin. The swellant composition comprises a compound represented by the general formula, R1 (OCn H2n)m O - R2 wherein R1 and R2 are independently selected from the group consisting of aryl groups and alkyl groups of 1-4 carbon atoms, n is 2 to 4 and m is 1 to 5. The swelled resin is then etched using, preferably, a highly alkaline composition such as a solution containing greater than about 100 g/1 NaOH. Other etchants such as chromic acid may also be used. The resin is now ready for plating using conventional techniques.
574350
Bastenbeck Edwin W.
Bellemare Richard A. Jr.
Haydu Juan
Enthone Incorporated
Ridout & Maybee Llp
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