Composition and process for conditioning the surface of...

Details Composition and process for conditioning the surface of... Composition and process for conditioning the surface of...

H - Electricity

05

K

6/4

H05K 3/38 (2006.01) C23C 18/22 (2006.01) H05K 3/00 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1237558

-18- Abstract An alkaline composition for enhancing the adhesiveness of metal plating to a plastic substrate comprising: (a) a compound represented by the general formula, Image and (b) a compound represented by the general formula, R3-(OCH2CH2)n-O - R4 wherein R1, R2, R3, and R4 are independently selected from the group consisting of hydrogen atoms, aryl groups and alkyl groups of 1-4 carbon atoms, m is 0 to 2 and n is 2 to 5; the compositions comprising, by weight, about 10 gram/liter (g/l) to saturation compound (a) and about 10 g/l to saturation compound (b). The composition is preferably employed before alkaline permanganate etching of the plastic, followed by electroless metal plating using conventional techniques.

481805

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