Composition and process for post-etch removal of photoresist...

G - Physics – 03 – F

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G03F 7/32 (2006.01) C11D 1/62 (2006.01)

Patent

CA 2599727

A composition and process for removing photoresist and/or sacrificial anti- reflective coating (SARC) materials from a substrate having such material(s) thereon. The composition includes a base component, such as a quaternary ammonium base in combination with an alkali or alkaline earth base, or alternatively a strong base in combination with an oxidant. The composition may be utilized in aqueous medium, e.g., with chelator, surfactant, and/or co- solvent species, to achieve high-efficiency removal of photoresist and/or SARC materials in the manufacture of integrated circuitry, without adverse effect on metal species on the substrate, such as copper, aluminum and/or cobalt alloys, and without damage to SiOC-based dielectric materials employed in the semiconductor architecture.

Composition et procédé d'élimination de la photorésine et/ou de la matière sacrificielle formant revêtement anti-réfléchissant déposée(s) sur un substrat portant une ou plusieurs matières de ce type. La composition comprend un constituant basique, par exemple une base d'ammonium quaternaire en association avec une base alcaline ou alcalino-terreuse, ou alors une base forte en association avec un oxydant. La composition peut être utilisée dans un milieu aqueux, par exemple avec des espèces du type co-solvant, tensioactif et/ou chélatant, afin d'assurer une élimination efficace de la photorésine et/ou de la matière sacrificielle formant revêtement anti-réfléchissant dans la fabrication des circuits intégrés, et ce sans altérer les espèces métalliques sur le substrat, par exemple des alliages de cuivre, d'aluminium et/ou de cobalt, et sans détériorer les matières diélectriques à base de SiOC utilisées dans l'architecture à semi-conducteurs.

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