Composition and process for the activation of resinous...

Details Composition and process for the activation of resinous... Composition and process for the activation of resinous...

C - Chemistry, Metallurgy

09

K

6/4, 117/77

C09K 3/00 (2006.01) C23C 17/00 (1980.01)

Patent

CA 1057468

ABSTRACT OF THE DISCLOSURE Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of permanganate to manganate being up to about 1.2, and the composition having a pH controlled in the range of 4 to 13. Means to regenerate the composition are also described. The process and compositions of this invention are useful in preparing base materials having a resinous surface for metallization by electroless technique. :, :

280903

Affiliated with

Also associated with

Rating

Composition and process for the activation of resinous... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition and process for the activation of resinous..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition and process for the activation of resinous... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-608852