Composition curable at low temperature

C - Chemistry – Metallurgy – 08 – L

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400/5344

C08L 43/04 (2006.01) C08F 2/08 (2006.01) C08F 2/14 (2006.01) C08K 5/00 (2006.01) C08L 101/00 (2006.01) C09D 143/04 (2006.01)

Patent

CA 1331660

ABSTRACT OF THE DISCLOSURE : . Disclosed is a composition curable at a low temperature and characterized in that the composition comprises: (a) a nonaqueous dispersion of a particulate polymer insoluble in an organic liquid and prepared by polymerizing a radical-polymerizable unsaturated monomer in the organic liquid in the presence of a dispersion stabilizer resin, the stabilizer resin being at least one of a copolymer comprising as its monomer components an oxirane-containing vinyl monomer and an alkoxysilane- containing vinyl monomer and a vinyl copolymer comprising as its monomer components a polysiloxane macromonomer and an oxirane-containing vinyl monomer, (b) a chelate compound admixed with the nonaqueous dispersion.

583277

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