C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5415, 356/6,
C08L 61/10 (2006.01) C08L 61/28 (2006.01) C08L 71/00 (2006.01) H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 3/20 (2006.01) H05K 3/28 (2006.01) H05K 1/09 (2006.01)
Patent
CA 2031516
2031516 9012695 PCTABS00002 This invention relates to a solder mask composition for thermoplastic substrates. The solder mask has critical components which include a polyhydroxyether and melamine formaldehyde. Other components include a solvent, filler and flow control agent. Optional ingredients include a colorant, epoxy resin and acid to promote the reaction of the composition. A surfactant can also be included. The solder mask provides the necessary flexibility and adhesion required for thermoplastic circuit boards. The mask can be applied directly to a circuit board or to a transfer medium for subsequent covering of a substrate. It relates to an article which can be a circuit board. It also relates to a process for making such composites which includes processing the solder mask.
Salensky George A.
Thoman Thomas S.
Amoco Corporation
Gowling Lafleur Henderson Llp
Salensky George A.
Thoman Thomas S.
LandOfFree
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