Composition for bonding electroconductive metal coating to...

Details Composition for bonding electroconductive metal coating to... Composition for bonding electroconductive metal coating to...

C - Chemistry, Metallurgy

23

C

400/7031, 400/70

C23C 28/04 (2006.01) C25D 5/54 (2006.01)

Patent

CA 1231190

COMPOSITION FOR BONDING ELECTROCONDUCTIVE METAL COATING TO ELECTRICALLY NONCONDUCTIVE MATERIAL ABSTRACT: This invention provides a composition comprising about 15 to about 75% by weight of a thermosetting or ultraviolet curable resin, about 24.5 to about 84.5% by weight of finely divided heat-resistant inorganic substance and about 0.5 to about 20% by weight of a finely divided palladium catalyst. This com- position is the solvent-free type and useful for forming an electroconductive metal coating on an electrically nonconductive base material by chemical plating.

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