C - Chemistry – Metallurgy – 23 – G
Patent
C - Chemistry, Metallurgy
23
G
C23G 5/00 (2006.01) B08B 3/10 (2006.01) C11D 7/22 (2006.01) H01L 21/70 (2006.01)
Patent
CA 2121543
Disclosed is a composition for use as a cleaning agent for microchips in the electronic industry. It basically comprises from 80 to 92% by weight of N-methyl pyrrolidone, and from 3 to 8% by weight of a dibasic ester selected from the group consisting of dimethyl succinate, dimethyl glutarate, dimethyl adipate and mixtures thereof. Preferably, it also comprises up to 5% by weight of .gamma.- butyrolactone, up to 7% by weight of ethylene glycol monoethyl ether acetate, and up to 10% by weight of a hydrocarbon derivative selected from the group consisting of naphtha derivatives, paraffins and isoparaffins. This composition is very efficient and actually much better than perchloroethylene. More particularly, this composition has a great ability to dissolve polar and non polar organic impurities. Morever, this composition does not leave electrically conducting residues and has a high boiling point, a high flash point and a low toxicity, which make it very safe in use.
Maruyama Shizuo
Radu Georges
Asahipen Corporation
E.qu.i.p. International Inc.
Robic
LandOfFree
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