Composition for cleaning silver or copper

C - Chemistry – Metallurgy – 23 – G

Patent

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Details

C23G 1/10 (2006.01) C11D 3/34 (2006.01) C11D 17/00 (2006.01) C11D 17/04 (2006.01) C23G 5/02 (2006.01)

Patent

CA 2233690

A chemical cleaning composition for silver- or copper-containing surfaces consists of a water-soluble solid or powder comprising thiourea or a derivative thereof, and is formulated in unit application form, e.g. in tablet or sachet form. A preferred composition comprises up to 60 % thiourea or a derivative thereof; up to 4 % surfactant; not more than 40 % acidifier; less than 20 % disintegrant; up to 10 % binder, 0 - 1 % lubricant and up to 40 % diluent.

L'invention concerne une composition de nettoyage chimique de surfaces renfermant de l'argent ou du cuivre. Cette composition comprend un solide ou une poudre soluble dans l'eau renfermant de la thio-urée ou un dérivé de celle-ci, et est formulée sous une forme d'application unitaire tel qu'un comprimé ou un sachet. Une composition préférée comprend jusqu'à 60 % de thio-urée ou d'un dérivé de celle-ci; jusqu'à 4 % d'un tensioactif; pas plus de 40 % d'un acidifiant; moins de 20 % d'un agent de désintégration; jusqu'à 10 % d'un liant; entre 0 et 1 % d'un lubrifiant et jusqu'à 40 % d'un diluant.

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