Composition for forming high thermal conductivity...

Details Composition for forming high thermal conductivity... Composition for forming high thermal conductivity...

C - Chemistry, Metallurgy

08

K

C08K 3/38 (2006.01) C08L 79/04 (2006.01)

Patent

CA 2250511

The present invention relates to a composition and method for forming a high thermal conductivity polybenzoxazine-based material. The composition comprises at least one benzoxazine resin and a filler material which includes particles of boron nitride in an amount sufficient to establish a thermal conductivity of between about 3 W/mK and 37 W/mK in the polybenzoxazine-based material.

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