Composition for preparing inorganic light weight foam, and...

Details Composition for preparing inorganic light weight foam, and... Composition for preparing inorganic light weight foam, and...

C - Chemistry, Metallurgy

08

J

403/69

C08J 9/06 (2006.01) C04B 26/08 (2006.01) C08J 9/00 (2006.01)

Patent

CA 1283749

Abstract of the Disclosure Disclosed herein is a foamable composition for preparing inorganic light weight foam, which comprises inorganic powder and vinyl chloride-based resin as main components, and contains an organic solvent and a foam- ing agent. The vinyl chloride-based resin is a higher molecular weight resin made by suspension-polymerization or mass-polymerization, and has an average degree of polymerization (?) of 1300 to 10000 as defined by JIS K-6721-1959. The ratio by weight of said inorganic powder to said vinyl chloride-based resin ranges from 50:50 to 85:15. The organic solvent has a solubility parameter (.delta.) of 7 to 10, and a boiling point of 80°C to 140°C. The ratio by weight of said organic solvent to the total amount of said inorganic powder and said vinyl chloride-based resin ranges from 60:40 to 40:60.

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