Composition for sensitizing articles for metallization

Details Composition for sensitizing articles for metallization Composition for sensitizing articles for metallization

C - Chemistry, Metallurgy

23

C

6/4

C23C 3/00 (1980.01)

Patent

CA 1052056

ABSTRACT OF THE DISCLOSURE There are provided compositions useful for the sensitization of non-metallic surfaces to the electroless deposition of metal from solution, the compositions comprising cuprous ions and cupric ions resulting from the admixture of a polar liquid medium, an acid, a halogen-containing compound and at least one member selected from the group consisting of a cuprous compound and a cupric compound. The sensitizing compositions represent an advance in the state of the art in that they can be rinsed with water without the need for drying beforehand, and upon rinsing form highly adherent derivatives which are anchored firmly to the surface.

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